The 10th International Conference on ASIC (ASICON 2013) will be held in Best Western Shenzhen Felicity Hotel, Shenzhen, China, during October 28-31, 2013. The conference is intended to provide an international forum for VLSI circuit designers, ASIC users, system integrators, IC manufacturers、process & device engineers and CAD/CAE tool developers to present their updated progresses, developments and research results in their respective fields. The three-day event features keynote speeches on state-of-the-art VLSI circuit、device、process design and manufacturing technologies, regular paper presentations, as well as tutorials delivered by leading experts in the respective fields. The Excellent Student Paper award will be announced at the conference. Additionally, an exhibition on EDA tools, foundry technologies, IC test facilities, and novel ASIC products will be held during the conference.
Paper submission deadline is extended to 15 July, 2013.