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2025 IEEE 16th International Conference on ASIC
Oct. 21-24, 2025, Crowne Plaza Kunming City Centre, Kunming, China
Invited Talks
| Name | Affiliation | Country/Region | Topic | ||
|---|---|---|---|---|---|
|
Yasuhiko Arakawa |
University of Tokyo | Japan |
(TBD) |
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|
Koji Asami |
University of Tokyo | Japan |
Some Signal Processing Techniques for Testing Wireless Communication LSIs |
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| Francis Balestra | CNRS-Grenoble INP-Sinano Institute | France | Future devices for high performance and low power operation | ||
| Jinshun Bi | Guizhou Normal University_ | China | Fabrication and Performance Optimization of IGZO Devices Aiming at Space Application | ||
| Yimao Cai | Peking University | China | (TBD) | ||
| Yu Cao | University of Minnesota | USA | Heterogeneous Integration for AI Computing | ||
| Zheng Chai | Xi'an JiaoTong University | China | Generation, modulation and application of spintronic Markov chain signal" |
||
| Mansun Chan | Hong Kong University of Science and Technology | Hong Kong, China | Technology Options for Complementary Field Effect Transistor (CFET) Circuits | ||
| Jiezhi Chen | Shandong University | China | On the Reliability of Sub-10nm Ultra-thin Ferroelectric HZO Thin Film | ||
| Ran Cheng | Zhejiang University | China | A device-to-circuit implementation of the high performance low temperature chips from the engineering perspective | ||
| Yasuo Cho | Tohoku University | Japan | Scanning nonlinear dielectric microscopy for developing next-generation high-performance electronic devices | ||
| Yann Deval | University of Bordeaux | Franch |
THE IMPACT OF BACK-GATE BIASING AND LAYOUT ON TEMPERATURE SENSITIVITY OF TRANSISTORS IN FD-SOI CMOS TECHNOLOGY |
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| Yuan Dong | Shanghai University |
|
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|
Zuoyuan Dong |
East China Normal University | China |
MICROSTRUCTURAL EVOLUTION AND RELIABILITY ANALYSIS OF RDL COPPER INTERCONNECTS UNDER HIGH-TEMPERATURE CONDITIONS |
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| Li Du | Nanjing University | China | (TBD) | ||
| Peng Feng | Institute of Semiconductors, Chinese Academy of Sciences | China | Recent Development of High Speed CMOS Image Sensors | ||
| Minoru Fujishima | Hiroshima University | Japan | A Single-Chip 300-GHz-Band Transceiver Using a CMOS Phased Array with Two-Dimensional Beam Steering Capability | ||
| Mingqiang Guo | University of Macau | Macau, China | Time-Domain vs. Voltage-Domain ADCs: Trade-offs in High-Speed Applications__ | ||
|
Koutaro Hachiya |
Teikyo Heisei University | Japan |
Success Rate Improvement of Analog Circuit Topology Generation by Large Reasoning Models |
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| Yuhui He | Huazhong University of Science and Technology | China | Stacked 2D materials Nanopore Sensors | ||
| Qianqian Huang | Peking University | China | Ultra-low power complementary tunneling transistors based on standard CMOS platform_and their applications | ||
| Makoto Ikeda | University of Tokyo | Japan | Hardware Accelerator design for Functional Encryption | ||
| Mahfuzul Islam | Institute of Science Tokyo | Japan | High-speed and energy-efficient true random number generator based on a self-compensating mechanism | ||
| Zhigang Ji | Shanghai Jiao Tong University | China |
(TBD) |
||
| Anquan Jiang | Fudan University | China | A Low-temperature ferroelectric domain wall memory | ||
|
Shyh-Jye Jerry Jou |
Yang Ming Chiao Tung University | Taiwan, China |
An Hardware-Efficient Doppler Estimation and Compensation in PDSCH for 5G Non-Terrestrial Networks |
||
| Mineo Kaneko | Japan Advanced Institute of Science and Technology | Japan | Coding Schemes of Carry Propagation Structures for Generating and Optimizing Parallel Prefix Adders | ||
| Haruo Kobayashi | Gunma University | Japan | Noise Notch Frequency Design for EMI Mitigation in DC-DC Converters Using Digital-to-Time Converter | ||
| Moufu Kong | University of Electronic Science and Technology of China | China | SiC/GaN/Ga2O3 high-voltage power devices | ||
| Jing Li | University of Electronic Science and Technology of China | China | (TBD) | ||
| Xiaoxi Li | Xidian University | China |
(TBD) |
||
| Yanli Li | Fudan University | China |
(TBD) |
||
| Yibo Lin | Peking University | China | ATSim: Thermal Simulation Framework for 2.5D/3D Chiplet Integration Systems with Application to Thermal Optimization | ||
| Xiaoyan Liu | Peking University | China | (TBD) | ||
| Liyuan Liu | Institute of Semiconductors, Chinese Academy of Sciences | China | Vision Chips | ||
| Ye Lu | Fudan University | China | The Generative Design of Analog and Radio Frequency Integrated Circuits | ||
| Wayne Luk | Imperial College | UK | domain-specific AI hardware acceleration | ||
| Yufei Ma | Peking University | China | Optimization of Mapping Strategies for AI Accelerators with Multiple Computing-in-Memory Macros. | ||
|
Nobuhiko Nakano |
Keio University | Japan |
Self-Powered Chips Integrating On-Chip Solar Cells in Standard CMOS Technology |
||
| Wai Tung Ng | University of Toronto | Canada | Smart Gate Drive ICs for WBG Power Transistors | ||
| Yong-Young Noh | Pohang University of Science and Technology | Korea | Development of high-performance p-type Transistors |
||
| Xizhu Peng | University of electronic science and technology of China | China | Back ground calibration technique with fast convergence speed for TI ADCs | ||
| Hao Qiu | Nanjing University | China | (TBD) | ||
| Yiming Qu | East China Normal University | China | (TBD) | ||
| Zhiqiang (Walkie) Que | Imperial College | UK | (TBD) | ||
| Francois Rivet | Univ. Bordeaux | France | The Sequency Domain: an Opportunity for Future AI-enhanced Radio Frequency Circuits and Systems |
||
| Youhua Shi | Waseda University | Japan |
Breakdown-Aware Pre-Biasing for Highly Efficient Power Conversion in TENG-Based Energy Harvesting |
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| Xin Si | Southeast University | China | Challenges and Trends of Floating-Point Computing-in-Memory Circuits | ||
| Hongfei Su | Tianjin University | China | An Alternative Approach to SPICE for Device Modelling of Semiconductor Technology | ||
| Viktor Sverdlov | Institute for Microelectronics, TU Wien | Austria | Emerging magnetoresistive memories: Modeling and simulation apprioach | ||
| He Tang | University Of Electronic Science And Technology Of China | China | (TBD) | ||
| Toru Tanzawa | Waseda University | Japan | Power management circuit for energy harvesting | ||
| Akira Tsuchiya | University of Shiga Prefecture | Japan | Liquid shape sensor for digital microfluidic system | ||
| Jing Wan | Fudan University | China | Si-2D heterointegration and its applications | ||
| Chua-Chin Wang | Sun Yat-Sen University | Taiwan, China | CMOS-based Active Gate Drive Circuit with User-Defined Miller Drive Strength Profiles and High Resolution DPWM Circuit Design | ||
| Changjin Wang | Nanjin University | China | Oxide-based spiking neuron for neuromorphic perceptual and computing | ||
| Chen Wang | Fudan University | China |
(TBD) |
||
| Qi Wang | Fudan University | China | Improving EUV Patterning Fidelity and Aberration Control through Source-Mask Co-Optimization | ||
| Albert Wang | University of California, Riverside | USA | (TBD) | ||
| Runsheng Wang | Peking University | China | The Quest for Reliable AI Accelerators: Cross-Layer Evaluation and Design Optimization | ||
| Yan Wang | Tsinghua University | China | Characterization and Modeling Methods for Power and RF GaN HEMTs | ||
| Xing Wu | East China Normal University | China | (TBD) | ||
| Heng Wu | Peking University | China | TBD (Tentative one: Opportunities and Innovations for Logic Technology with Dualsided Integrations) | ||
| Chunlei Wu | Fudan University | China | An Analytical Model for Extremely Scaled Gate-All-Around Tunnel Transistors and Its Implications on the Scaling Theory | ||
| Yu Xiao | Xidian University Hangzhou Institute of Technology | China | Enhancement of HfO₂-Based Ferroelectric Thin Film Performance via Interface and Defect Engineering | ||
| Sixing Xiong | Zhejiang University | China | (TBD) | ||
| Xiaoyong Xue | Fudan University | China | Accelerating LLMs in Hybrid CIM Systems in Edge Devices | ||
| Jie Yang | Westlake University | China | Towards general-purpose neuromorphic Systems: from Alogrithm to Silicon Deployment | ||
| Kiat Seng Yeo | Singapore University of Technology and Design | Singapore | An Alternative Approach to SPICE for Device Modelling of Semiconductor Technology | ||
| You Yin | Gunma University | Japan | Phase change memory | ||
| Tomyouki Yokota | University of Tokyo | Japan | Flexible organic electronics for the biosignal measurement | ||
| Bei Yu | Chinese University of Hong Kong | Hong Kong, China | Accelerated Lithography Simulator for Large-Scale Layouts | ||
| Hongyu Yu | southern university of science and technology | China | (TBD) | ||
| Shuangming Yu | Institute of Semiconductors, Chinese Academy of Sciences | China | Full-spiking bio-inspired target detection vision algorithm based on attention prediction mechanism for DVS and SPAD sensors | ||
| Wenjian Yu |
Tsinghua University
|
China |
(TBD) |
||
| Bo Zhang | University of Electronic Science and Technology of China | China | Advanced Gate Driver Solutions for Fast-Switching SiC Power Device Applications | ||
|
Weijia Zhang |
Hong Kong University of Science and Technology | Hong Kong, China |
Recent Design Trends of Gate Driver IC for WBG Power Devices |
||
| Bo Zhao | Zhejiang University | China |
A Polar-Modulation Backscatter Technique |
||
| Changjian Zhou | South China University of Technology | China | Boosting the self-driven properties of 2D materials-based photodetectors via asymmetrical device engineering | ||
|
Pingqiang Zhou |
ShanghaiTech University | China |
(TBD) |
||
| Zekun Zhou | University of Electronic Science and Technology of China | China | High-efficiency Power Extraction Interface for Piezoelectric Energy Harvesting | ||
|
Xiaona Zhu |
Fudan University | China |
Multi-Vt Solutions in GAA and CFET Devices |
||
| Ningmuu Zou | Nanjing University | China |
(TBD) |
Update by: 2025-06-03
Contact
Prof. Huihua Yu (Conference Issue) Prof. FanYe (Paper Submission)
Email: asicon_org@fudan.edu.cn Email: fanye@fudan.edu.cn
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