2023 IEEE 15th International Conference on ASIC

Oct. 24-27, 2023, Platinum Hanjue Hotel, Nanjing, China

Invited talks

Name

Affiliation

Country/Region

Topic

Francis Balestra

Grenoble INP-Minatec / Sinano Institute

France

Nanodevices for the end of the Roadmap

Yimao Cai

Peking  University

China

To be determined

Yu(Kevin) Cao

Arizona State University

USA

Heterogeneous Integration for Energy-efficient AI Computing

Mansun Chan

Hong Kong University of Science & Technology

Hong Kong,China

Design of Time of Flight Sensors for Intelligent 3D Imaging Systems

Edward Y Chang

Yang Ming Chiao Tung University

Taiwan,China

To be determined

Kuan-Neng Chen

Yang Ming Chiao Tung University

Taiwan,China

Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration

Rong Chen

Huazhong University of Science and Technology

China

Selective atomic layer deposition to extend Moore’s Law and beyond

Jiezhi Chen

Shandong University

China

To be determined

Chao-Hsin Chien

Yang Ming Chiao Tung University

Taiwan,China

Issue about 2D Device

Steve Chung

Yang Ming Chiao Tung University

Taiwan,China

Resistance Memory-Based Physical Unclonable Function (PUF) in High-k Metal-gate
CMOS Generations

Giovanni De Micheli

EPFL

Swiss

Logic synthesis for emerging technologies

M.Jamal Deen

McMaster University

Canada

To be determined

Jyh-Chyurn Guo

Yang Ming Chiao Tung University

Taiwan,China

The Impact of Strain Engineering and Layout Dependent Effects on High Frequency Performance and Low  Frequency Noise in Nanoscale Devices

Yufeng Guo

Nanjing University of Posts and Telecommunications

China

AI-based Design Technology of Semiconductor Power Devices

Yoshiaki Hagiwara

Sojo University

Japan

Dedicated Frequency Transformation (DFT) ASIC Hardware Engine for Real-time AIPS Robot Vision Application

Jifa Hao  Google USA To be Determined

Ming He

Peking University

China

Multi-Modal Intelligent Sensors

Yuhui He

Huazhong University of Science and Technology

China

To be determined

Weida Hu

Shanghai Institute of Science and Technology

China

Nanoscale photodetectors for infrared remote sensing and intelligent recognition

Mengyuan Hua

Hong Kong University of Science & Technology

Hong Kong,China

Processes of p-GaN Gate HEMTs for High-efficiency and High-reliability Applications

Qianqian Huang

Peking University

China

HfO2-based Ferroelectric Devices for Low-Power Applications

Makoto Ikeda

University of Tokyo

Japan

Hardware Acceleration of Functional Encryption (Tentative)  

Mahfuzul Islam Kyoto University Japan

Utilizing Order Statistics for Low-power Analog Circuit Design in Scaled CMOS Technologies

Hiroshi Iwai

Tokyo Institute of Technology

Japan

To be determined

Anquan Jiang

Fudan University

China

Fatigue-free ferroelectric domain-wall memory

Gerhard Klimeck

Purdue University

USA

Quantum Transport for Modern Transistors in NEMO5 and global impact with nanoHUB.

Haruo Kobayashi

Gunma University

Japan

Back to the Analog Neural Network and Linear Circuit Theory

Haruo Kobayashi Gunma University Japan low-distortion signal generation technologies for analog/mixed-signal IC testing
Kazutoshi Kobayashi Kyoto Institute of Technology Japan Classical Eectronics to Control Qubits and Correct Errors

Mario Lanza

King Abdullah University of Science and Technology

Saudi Arabia

Hybrid 2D/CMOS integrated circuits for neuromorphic computation

Ching-Ting Lee

Cheng Kung University

Taiwan,China

To be determined

Jing Li University of Electronic Science and Technology of China China

High-resolution Ultra-low-power CMOS Temperature Sensor

Jyi-Tsong Lin

Sun Yat-Sen University Taiwan,China

To be determined

Yibo Lin

Peking University

China

Intelligent and Interactive Analog Layout Design Automation

Xiaoyan Liu

Peking University

China

UTBB Based Photoelectric Field Effect Transistors for In-Sensor Computing

Xianhe Liu

Fudan University

China

Improved BEOL Design Rules with 45-degree local interconnection

Yefan Liu

Innostar-Semi.

China

Overcoming the challenges of ReRAM towards mass production from the perspectives of process, design and application

Weiqiang Liu

Nanjing University of Aeronautics and Astronautics

China

Approximate Computing: from Circuits to Applications

Wayne Luk

Imperial College London

UK

Reconfigurable Computing

Dongsheng Ma

University of Texas at Dallas

USA

Powering Next Generation Datacenters: Hybrid-Path DC-DC Power Conversion for High Current Density

Feng Miao

Nanjing University

China

Atomic Lego for future computing

Kyeong-Sik Min

Kookmin Univ.

Korea

Optimizing the mapping between convolutional neural networks and memristor crossbars

Zhenghua Ni

Southeast University

China

Position sensitive detectors based on two dimensional materials

Vojin G Oklobdzija

New Mexico State University

USA

To be determined

Hao Qiu

Nanjing University

China

To be determined

Richard Rao Marvell Technology USA

Heterogeneous Integration Reliability Methodology and Challenges

Frank Schwierz

Technische Universitaet Ilmenau

Germany

Microwave Transistors – The backbone of 5G and Beyond Communication Systems
Memristive Devices – The Core Components of Future Energy-Efficient Neuromorphic Computing   

Yeo Kiat Seng

Singapore University of Technology and Design

Singapore

Concurrent tri-band CMOS low noise amplifier design for 2.45/5.65/60-GHz applications

Adam W. Skorek

University of Quebec

Canada

Digital Twins and ASIC

Teruo Suzuki

Socionext Inc.

Japan

Issue about ESD & Latch-up

He Tang

University of Electronic Science and Technology of China

China

An NN-based calibration algorithm for high-speed high-resolution ADCs

Li Tao

Southeast University

China

Emerging 2D Materials and Devices Enabled Wearable Wireless Circuits

Akira Tsuchiya The University of Shiga Prefecture Japan High-Speed, Low-Power, and Small-Area Optical Receiver

Changjin Wan

Nanjing University

China

Metal Oxide-based Neuron for Neuromorphic Computation and Perception

Albert Wang

University of California, Riverside

USA

To be determined

C.C. Wang

Sun Yat-sen University

Taiwan, China

Issue about HV CMOS IC Design

Kaiyou Wang

Institute of Semiconductors, Chinese Academy of Sciences

China

To be determined

Runsheng Wang

Peking  University

China

Three Research Themes in the Quest to Extend the Moore's Law

Xiaoqing Wen

Kyushu Institute of Technology

Japan

Power-Aware Testing in the Era of IoT

Ngai Wong

The University of Hong Kong

Hong Kong,China

A Multi-Objective Loss Function Design for RRAM-based Neural Architecture Search

Andy Wu

Nanyang Technological University

Taiwan,China

To be determined

Hsien Tsai Wu

Dong Hwa University

Taiwan,China

Sensors, chemical and bio-chips in IV. New Techniques, New Processing, New
Devices and Their Applications

Nanjian Wu

Institute of Semiconductors, Chinese Academy of Sciences

China

CMOS Terahertz Detector and Image Sensor

Xing Wu

East China Normal University

China

In Situ Device and System

Qiang Wu

Fudan University

China

To be determined

Sixing Xiong

RIkagaku KENkyusho(RIKEN)

Japan

Ultra-flexible organic photovoltaics for powering wearable electronics

Jian-Bin Xu

The Chinese University of Hong kong

Hong Kong,China

To be determined

J.Joshua Yang

University of Southern California

USA

Issue about Neuromorphic computing

Yuchao Yang

Peking University

China

Memristor Chips and Systems for Energy-Efficient Learning

Zhuoqing Yang

Shanghai Jiao Tong University

China

D MEMS Devices Fabricated on Ultrathin Cylindrical Substrate For Flexible Wearable Applications

Zuochang Ye

Tsinghua University

China

Toward Fully Automatic Analog Circuit Design

 
 

Jiandong Ye

Nanjing University

China

Hetero-integration of Ga2O3 bipolar devices toward power electronics.

You Yin

Gunma University

Japan

Issue about Phase change memory

Bei Yu

The Chinese University of Hong kong

Hong Kong,China

To be determined

Patrick Yue

Hong Kong University of Science & Technology

Hong Kong,China

To be determined

J.F. Zhang

Liverpool John Moores University

UK

Modelling and predicting RTN in nanoscale devices

Weidong Zhang

Liverpool John Moores University

UK

To be determined

Yue Zhang

Beihang University

China

Spintronic In-Memory-Computing:From Devices to Circuits                                                 

Qiang Zhao

Nanjing University of Posts and Telecommunications

China

To be determined

Xing Zhou

Nanyang Technological University

Singapore

Scalable Compact Model for High-frequency GaN-HEMTs

Peng Zhou

Fudan University

China

The Road of 2D Semiconductors in Silicon Age

Pingqiang Zhou

Shanghai Tech University

China

Research on the Reliability of ReRAM-based Neural Network Accelerators