Title：Advancing Emerging Device and Architecture Innovations in the AI Era
Location: Meeting Room 1, 3rd Floor, Crowne Plaza Kunming City Centre
Time: 15:45-16:30, Oct. 22, 2025, Wednesday
Speaker: Prof. Ming Liu (Fudan University, China)

Abstract: As Moore’s Law reaches its physical limits, innovation in integrated circuits (ICs) is shifting towards new device architectures and integration technologies. Emerging logic devices focus on 3D structures, such as nanowire transistors, complementary FETs (CFETs), and 2D materials. Advanced memory technologies include RRAM, MRAM, and FeRAM for CMOS compatibility, as well as evolving 3D DRAM and NAND for higher capacity and speed. At the system level, novel paradigms such as compute-in-memory and 3D chiplet integration, co-designed with these new devices, aim to overcome the performance limitations of conventional von Neumann architectures, enhancing efficiency and scalability.

Bio: 

Prof. Liu Ming is the Directer of the Frontier Institute of Chip and System, Fudan University, Chinese Academy of Sciences (CAS). She is also the academician of CAS and the World Academy of Sciences, IEEE /TWAS Fellow. She received the B.S. and M.S. degrees in semiconductor physics and device from Hefei University of Technology, Hefei, China, in 1985 and 1988, respectively, and the Ph.D. degree in microelectronics from Beijing University of Aeronautics and Astronauts, China, in 1998. From 1998 to 1999, she was a Postdoctoral Scholar in the Chinese Academy of Sciences (CAS). She joined the Institute of Microelectronics, CAS, in 2000. She was appointed as a professor at Fudan University in 2021.

She has been engaged in the field of microelectronics science and technology, focusing on mechanisms of memory devices, material structures, and chip integration. She has published more than 300 papers in top journals and conferences such as Science, Nature Materials, Nature Nanotechnology, Nature Electronics, IEEE EDL/TED/JSSC, ISSCC, IEDM, VLSI, with over 20,000 citations. Ten papers are selected as ESI Highly Cited Papers, and five works are included in ITRS/IRDS. Her research has been written into 15 technical books and 40 reviews by internationally renowned scholars. She co-authored two technical books and one translated book. She has been granted 313 patents (including 30 US patents), among which several patents are transferred/licensed to multiple important integrated circuit enterprises.